Foerword (F. Ianna).

Preface.

Acknowledgments.

OVERVIEW.

Introduction (H. Chan and P. Englert).

Principles of Stress Testing (H. Chan and P. Englert).

PROCESS AND GUIDELINES.

Stress Testing Program: Generic Processes (H. Chan and P. Englert).

Stress Testing Program Subprocesses (H. Chan and P. Englert).

Guidelines for Design and Manufacturing Stress Testing (H. Chan and P. Englert).

THEORY.

Economic and Optimization (H. Chan and P. Englert).

Reliability Growth (C. Seusy).

Overview of the Failure Analysis Process for Electrical Components (G. Pfeiffer).

EQUIPMENT AND TECHNIQUES.

Accelerated Stress Testing Equipment and Techniques (C. Felkins).

Vibration and Shock Inputs Identify Some Failure Modes (W. Tustin).

Relative Effectiveness of Thermal Cycling Versus Burn-In (K. Lo and F. LoVasco).

Accelerated Qualification of Electronic Assemblies Under Combined Temperature Cycling and Vibration Environments: Is Miner's Hypothesis Valid (K. Upadhyayula and A. Dasgupta)?

Liquid Environmental Stress Testing (LEST) (P. Englert).

Safety Qualification of Stress Testing (S. Rajaram).

BEST PRACTICES CASE STUDIES IN COMPUTER, COMMUNICATIONS, AND OTHER INDUSTRIES.

Production Ast with Computers Using the Taguchi Method (D. Pachuki).

Design Ast with Vendor Electronics (C. Schinner).

Design and Production Ast with Power Supplies (D. Dalland).

Design and Production Ast with Computers (E. Kyser).

Qualifications and Production Sampling Ast with Printed Circuit Boards (H. McLean).

Manufacturing Ast with Telecommunication Products (T. Parker and G. Harrison).

Productionn Ast with Computer Disks.

Benchmarking (H. Malec).

Glossary of Stress Testing Terminology.

Bibliography.

Index.

Epilogue.

About the Editors.